AMD has a lot to talk about this year at CES, and much more in-depth than they may have last year. First, the details for the next generation FreeSync come out, and now we’re much closer to the release of Zen with actual details on motherboards that will be sporting their new 300-series chipsets being released, with the X370 being the flagship. Curious that they’re using the same -70 moniker as Intel.
Ryzen is becoming more tangible with the X370 chipset announcement
Today they’re announcing three chipsets to fill out all three segments, the entry-level, mid-range and high-end, with the A320, B350 and X370 respectively. X370 has support for dual-channel DDR4 memory, support for m.2 and u.2 NVMe SSD’s, native support for USB 3.1 with enough PCIe lanes for external graphics, if BIOS’ are made to support it.
There are 16 motherboards in total that have been announced from ASRock, ASUS, Biostar, Gigabyte and MSI. More details are hopefully coming soon.
- ASRock X370 Taichi
- ASRock X370 Gaming K4
- ASRock AB350 Gaming K4
- ASRock A320M Pro 4
- ASUS B350M-C
- Biostar X370GT7
- Biostar X350GT5
- Biostar X350GT3
- GIGABYTE AX370-Gaming K5
- GIGABYTE AX370-Gaming 5
- GIGABYTE AB350-Gaming 3
- GIGABYTE A320M-HD3
- MSI X370 XPower Gaming Titanium
- MSI B350 Tomahawk
- MSI B350M Mortar
- MSI A320M Pro-VD